Electronic materials - Entire Technology Co., Ltd.

Low Dk/Df Microsphere Silica Filler

Ultra-fine spherical silica filler designed for high-frequency and high-speed electronic materials, improving dimensional stability and signal transmission performance.

Product Positioning & Solution

Entire Technology's Low Dk/Df Microsphere Silica Filler is engineered for Copper Clad Laminate and IC substrate applications. Its excellent thermal stability helps minimize the thermal expansion of resin substrates, improving compatibility with copper foil and semiconductor chips and enhancing dimensional stability during high-temperature processing. Its ultra-low dielectric properties also help reduce signal loss and propagation delay, supporting stable high-frequency and high-speed signal transmission.

- Features & Benefits -

Low CTE

Reduces substrate thermal expansion to better match copper foil and chips, helping minimize warpage or delamination during high-temperature processing.

High Sphericity

High sphericity provides excellent flowability, helping optimize filler loading while reducing drilling tool wear.

Low Df

Reduces energy dissipation along high-frequency signal transmission paths to maintain signal integrity.

Low Dk

Helps reduce signal distortion and propagation delay in high-frequency applications.

High Dimensional Stability

Maintains structural stability under high-temperature and high-pressure processing conditions.

- Technical Evidence -

Particle size distribution and microstructure characterization demonstrate the particle size and spherical morphology of the silica filler.

- Applications -

Copper Clad Laminate (CCL)

Suitable for high-frequency and high-speed electronic material applications, supporting dimensional stability and reliable signal transmission.

IC Substrate

Excellent thermal stability and low dielectric properties support demanding high-end IC substrate applications.

For samples, technical information, or business inquiries, please contact us.

Semiconductor Process Films

Designed for semiconductor processes such as wafer thinning, dicing, and die pickup, our high-performance base film solutions deliver process protection, stable handling, and clean release performance.

Product Positioning

Entire Technology's semiconductor process films are engineered for critical processes including wafer back grinding, dicing, expansion, and die pickup. With excellent mechanical buffering, process stability, and clean debonding performance, these film solutions help improve process reliability and yield while meeting the precision requirements of advanced semiconductor manufacturing.

High Cleanliness & Low Residue
Mechanical Performance & Stretchability
Process Stability & Yield Improvement
Material Platform

Semiconductor Process Flow

Wafer

B/G Tape Base Film

Back Grinding

Wafer Surface Protection、Stress Absorption、Grinding Thickness Control

Dicing Tape Base Film

Dicing

Expansion

Die Pickup

Die Fixation、Water-Resistant Dicing、Uniform Expansion、Die Pickup

B/G Tape Base Film
Back Grinding Tape Base Film

Designed for wafer back grinding processes, the B/G Tape Base Film provides excellent thickness uniformity, step coverage, and mechanical buffering to protect delicate wafer microstructures and support stable wafer thinning performance.

Low Total Thickness Variation

Optimizes wafer thickness uniformity and helps reduce warpage and cracking after thinning.

High Step Coverage

Provides effective coverage over fine wafer structures to help prevent process fluid penetration.

Advanced Mechanical Buffering

Absorbs mechanical stress generated during wafer thinning to protect delicate wafer microstructures.

Residue-Free Interfacial Delamination

Enables controlled adhesion reduction after UV irradiation for clean and efficient debonding.

Dicing Tape Base Film

Designed for wafer dicing, expansion, and die pickup processes, the Dicing Tape Base Film provides excellent shear strength and water resistance for secure die fixation during dicing, together with biaxial stretchability and UV-controlled adhesion reduction for efficient downstream processing.

High Shear Strength

Securely holds individual dies and helps prevent die shift during wafer dicing.

Superior Water Resistance

Maintains stable adhesion and helps prevent water ingress during dicing and high-pressure rinsing.

Excellent Biaxial Stretchability

Provides uniform biaxial expansion to facilitate die separation while reducing tape tearing risk.

Precision UV-Curable Technology

Provides stable adhesion during dicing and controlled adhesion reduction after UV irradiation for efficient die pickup.

- Core Technical Capabilities -

Process Stability

Consistent and reliable performance across different process conditions.

Wafer Protection

Mechanical buffering helps reduce wafer damage risk during grinding and dicing.

Precision Interface Control

Precisely controlled adhesion and release behavior for different semiconductor processes.

Yield Improvement

Integrates material and process performance to support overall yield and reliability.

- Film Structure -

Material Platform

PVC / PO / EVA / PET

Release Technology

UV-Controlled Debonding

Customized Design

Film structure and properties can be adjusted based on process and application requirements.

- Applications -

Back Grinding

Wafer Dicing

Wafer Expansion

Die Pickup

Semiconductor Packaging

Need a customized semiconductor process film solution?

Contact Entire Technology to discuss film solutions tailored to your process and application requirements.

High-Temperature Insulating Film

Designed for semiconductor, electronics, automotive and advanced industrial applications, our high-temperature insulating films deliver excellent heat resistance, electrical insulation, chemical resistance and dimensional stability.

Product Overview

Entire high-temperature insulating films are developed for high-temperature processes and demanding environments. We provide a variety of material, thickness and functional solutions to meet customer design, processing and application needs.

- Key Performance -

Excellent Heat Resistance

Maintains stable performance under prolonged high-temperature conditions.

Excellent Electrical Insulation

Superior insulation performance ensures electrical safety.

Chemical Resistance

Excellent resistance to chemicals for extended service life.

Dimensional Stability

Low thermal expansion ensures dimensional stability and minimizes deformation.

Mechanical Strength & Wear Resistance

High mechanical strength and wear resistance for enhanced reliability.

Customizable Solutions

Materials, thickness, and functionality can be customized to meet specific requirements.

- Applications -

Semiconductor Process

Process protection, electrical insulation and high-temperature film materials for semiconductor manufacturing.

Flexible Circuit Board

Suitable for FPCB, rigid-flex boards and heat-resistant insulation applications.

Electronics & Electrical

Used for motor insulation, sensors, electronic components and protective materials.

Automotive & Aerospace

Designed for high-temperature insulation, lightweight structures and high-reliability applications.

Consumer Electronics

Suitable for acoustic diaphragms, wearable devices and precision electronic components.

Industrial Equipment

Provides chemical resistance, wear resistance and protection in high-temperature environments.

- Material Solutions -

PEEK Series Film

High heat resistance, chemical resistance and wear resistance
Good mechanical strength and fatigue resistance
Suitable for electronic insulation, industrial and aerospace applications

TPI Series Film

High heat resistance with thermoplastic processability
Excellent electrical insulation and chemical resistance
Suitable for FPCB, semiconductor and high-temperature insulation applications

Other Customized Materials

In addition to the above materials, other high-temperature insulating films can be evaluated and developed based on customer application conditions, processing temperature, thickness and functional requirements.

- Material Selection Guide -

Evaluation Items	PEEK Series	TPI Series	Remarks
Heat Resistance			Varies depending on material type and thickness
Electrical Insulation			Varies depending on material type and thickness
Chemical Resistance			Varies depending on the actual chemical environment
Mechanical & Wear Resistance			Varies depending on processing and operating conditions
Thermoplastic Processability			Varies depending on processing equipment and conditions
Typical Applications	Electronics, Acoustics, Machinery, Aerospace	FPCB, Semiconductor, Electrical Insulation	—

Rating Guide: Excellent Good to Excellent Good

Customized Specifications & Technical Consultation

Contact us for material recommendations and specification evaluation based on your application, processing conditions and product design